Wafer Dicing Services
American Dicing offers high precision dicing and scribing of silicon wafers. We also handle cutting materials such as quartz and sapphire. Wafer production services include dicing of up to 12 inch wafers. Our wafer production facility is capable of handling small and large quantities of wafers and substrates.
7100 Series
Pro Vectus 2”
- 8” chuck
- Index accuracy — 1µm
- Z accuracy — 1µm
- Z spindle — 60,000 RPM
- Chuck flatness — 10µm
- ø — closed loop Theta
- Pattern recognition systems (PRS)
- Load monitor
Pro Fortis 2”
- Dice up to .600” thick
- 4” spindle — 30,000 RPM
7200 Series
MegaDice
- Fully automatic — 12” capability
- 2”-3” high-torque
- DC-brushless
- Air-bearing
- 2.4KW
- 60,000 RPM spindle
- Optimized for package singulation and IC applications
- Fully automatic saws for high production runs
- Surfactants and CO2 bubbler available
- Small or large quantities for all materials
- Custom dicing (slotting, multi depth, bevel, and angle cutting)
- Wafer sizes from .25” to 12” (300mm) diameter
- Substrates from .002" up to .6" thick
- Handle wafers on film frames or hoops, 100% saw-through (or as specified)
- Experience in image sensor dicing, RFID, solar panels, bonded wafers (Si on glass) MEMS devices
- Non-standard mask layouts (for handling many different size die on one substrate)
Contact Us
American Dicing, Inc.
7845 Maltlage Drive
Liverpool, NY 13090
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American Dicing, Inc.
7845 Multlage Drive, Liverpool, NY 13090
Phone: 315.428.1200
Fax: 315.428.1211
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